Home / TD and Integration / Tape Out Engineering Principal Engineer/ Senior Engineer/ Engineer (TOEIC Score 750)

Tape Out Engineering Principal Engineer/ Senior Engineer/ Engineer (TOEIC Score 750)
 

Closing Date: 23 Dec 2017

Responsibilities:

  • To handle development and engineering tapeouts which require non-standard frame and prime die data handling while establishing a production friendly way of working for Operation team after development phase.
  • To work closely with Technology Development team, Process integration team and Product Engineering team to resolve customers’ design issues and improve the product yield.
  • To work with Tapeout Operation team to develop automation scripts (Perl, TCL, Shell) and systems to streamline tapeout processes.
  • Responsible for automation script documentation and management.
  • To train the Tapeout Operation team competency on the script architecture and operation.
  • To lead productivity projects and ensure project closure according to project timeline.
  • To deliver value added services to customers through DFM, yield enhancement projects and engineering requests activities.
  • Familiar with Cadence MaskCompose for frame data preparation.
  • Familiar with Synopsys MBOPC, Synopsys CATS and Cadence PVS for prime-die OPC and booleans.

Requirements:

  • Minimum Bachelor Degree in Electrical and Electronics or Microelectronics Engineering.
  • Minimum 3 years of relevant experience in wafer fabrication or IC design environment.
  • Preferably with knowledge of semiconductor and Microelectronics process workflow.
  • Expertise in Shell, Perl or TCL scripting is a must.
  • Knowledge in UNIX/LINUX commands is required.
  • Familiar with Cadence Virtuoso, MySQL client program is preferred.
  • Able to work as a team and multi-task.
  • Passion to learn new skills.
  • Driven, motivated, takes initiative and meticulous.

TOEIC score required: 750

Interested parties can apply for the position here: http://ssmc.applyourjobs.com/

 
 
 
Job Listing